The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 2008
Filed:
Jul. 12, 2006
Sang-gab Kim, Seoul, KR;
Woo-geun Lee, Yongin-si, KR;
Shi-yul Kim, Yongin-si, KR;
Jin-ho Ju, Seoul, KR;
Jang-soo Kim, Suwon-si, KR;
Sang-woo Whangbo, Seoul, KR;
Min-seok OH, Yongin-si, KR;
Hye-young Ryu, Seoul, KR;
Hong-kee Chin, Suwon-si, KR;
Sang-Gab Kim, Seoul, KR;
Woo-Geun Lee, Yongin-si, KR;
Shi-Yul Kim, Yongin-si, KR;
Jin-Ho Ju, Seoul, KR;
Jang-Soo Kim, Suwon-si, KR;
Sang-Woo Whangbo, Seoul, KR;
Min-Seok Oh, Yongin-si, KR;
Hye-Young Ryu, Seoul, KR;
Hong-Kee Chin, Suwon-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-Do, KR;
Abstract
The present invention provides a manufacturing method of a thin film transistor array panel, which includes forming a gate line on a substrate; forming a gate insulating layer, a semiconductor layer, and an ohmic contact on the gate line; forming a first conducting film including Mo, a second conducting film including Al, and a third conducting film including Mo on the ohmic contact; forming a first photoresist pattern on the third conducting film; etching the first, second, and third conducting films, the ohmic contact, and the semiconductor layer using the first photoresist pattern as a mask; removing the first photoresist pattern by a predetermined thickness to form a second photoresist pattern; etching the first, second, and third conducting films using the second photoresist pattern as a mask to expose a portion of the ohmic contact; and etching the exposed ohmic contact using a Cl-containing gas and a F-containing gas.