The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7371590 B1

PDF
Full Text
Expired
Date of Patent:
May. 13, 2008

Filed:

Nov. 21, 2005
Applicants:

Kevin Patrick Capaldo, Mount Vernon, IN (US);

Mark Allen Cheverton, Mechanicville, NY (US);

Dennis Joseph Coyle, Clifton Park, NY (US);

Michael John Davis, Mount Vernon, IN (US);

Sameer Kirti Talsania, Evansville, IN (US);

Masako Yamada, Niskayuna, NY (US);

Chung-hei Yeung, Evansville, IN (US);

Inventors:

Kevin Patrick Capaldo, Mount Vernon, IN (US);

Mark Allen Cheverton, Mechanicville, NY (US);

Dennis Joseph Coyle, Clifton Park, NY (US);

Michael John Davis, Mount Vernon, IN (US);

Sameer Kirti Talsania, Evansville, IN (US);

Masako Yamada, Niskayuna, NY (US);

Chung-hei Yeung, Evansville, IN (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
Abstract

A system for the inspection of and a process for the correction of defects in a microreplicated optical display film manufacturing process. The process steps of manufacturing a master, a plurality of shims from the master, and a multiplicity of display films from each shim are integrated with a systemic defect identification and correction process. Each primary manufacturing step has its own inspection system and correction process where defect information for that step of the process is fed back and analyzed; and from that analysis the subprocess is adjusted to eliminate or reduce the detected defect. The systemic defect is identified as to its source and then fed back and analyzed in the correction step of the respective subprocess in order to cure the root of the defect.


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