The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7371506 B1

PDF
Full Text
Expired
Date of Patent:
May. 13, 2008

Filed:

Mar. 06, 2006
Applicants:

Hirofumi Fujii, Ibaraki, JP;

Makoto Saito, Ibaraki, JP;

Kenji Ohnishi, Ibaraki, JP;

Inventors:

Hirofumi Fujii, Ibaraki, JP;

Makoto Saito, Ibaraki, JP;

Kenji Ohnishi, Ibaraki, JP;

Assignee:

Nitto Denko Corporation, Ibaraki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/00 (2006.01); G03F 7/004 (2006.01);
U.S. Cl.
CPC ...
Abstract

A positive photosensitive resin composition comprising (A) a polyamic acid, (B) a 1,4-dihydropyridine derivative represented by the general formula (II): wherein Ris a monovalent organic group; each of R, R, R, and Ris independently hydrogen or a monovalent organic group; and Ar—NOis an aromatic hydrocarbon group having a nitro group at ortho-position, and (C) an amine compound.


Find Patent Forward Citations

Fujii, Hirofumi. (2008). Positive photosensitive resin composition (U.S. Patent No. 7371506). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7371506

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