The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 13, 2008

Filed:

Apr. 23, 2003
Applicants:

Manabu Tsumura, Settsu, JP;

Masahito Ide, Settsu, JP;

Katsuya Ouchi, Nishinomiya, JP;

Masafumi Kuramoto, Anan, JP;

Tomohide Miki, Anan, JP;

Ikuya Nii, Anan, JP;

Inventors:

Manabu Tsumura, Settsu, JP;

Masahito Ide, Settsu, JP;

Katsuya Ouchi, Nishinomiya, JP;

Masafumi Kuramoto, Anan, JP;

Tomohide Miki, Anan, JP;

Ikuya Nii, Anan, JP;

Assignee:

Kaneka Corporation, Osaka-Shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 9/04 (2006.01); C08G 77/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides a curable composition providing a curing product having excellent adhesive properties and high transparency, or a curing product having high toughness and transparency. A curable composition which contains (A) an organic compound containing at least two carbon-carbon double bonds reactive with a SiH group in each molecule, (B) a silicon compound having at least two SiH groups in each molecule, (C) a hydrosilylation catalyst, (D) a silane coupling agent and/or an epoxy group-containing compound, and (E) a silanol condensation catalyst. A light-emitting diode sealed with a curing product obtainable by curing said curable composition.


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