The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 13, 2008

Filed:

May. 26, 2005
Applicants:

Hiroyuki Takase, Osaka, JP;

Shinichi Suzuki, Osaka, JP;

Yuuji Tanaka, Osaka, JP;

Inventors:

Hiroyuki Takase, Osaka, JP;

Shinichi Suzuki, Osaka, JP;

Yuuji Tanaka, Osaka, JP;

Assignee:

Kyocera Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03B 29/00 (2006.01); H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A set of resin sheets includes a plurality of resin sheets. Each resin sheet is disposed in a site to be a surface recess or inner void in a ceramic green sheet to be laminated, and a plurality of such ceramic green sheets each with the resin sheet disposed therein are laminated and fired, whereupon the resin sheets are removed by thermal decomposition during the firing. In the set of resin sheets, the relation of T<T≦Tis satisfied wherein T(° C.) indicates an 80% weight reduction temperature of an uppermost resin sheet, T(° C.) indicates an 80% weight reduction temperature of a lowermost resin sheet, and T(° C.) indicates a 20% weight reduction temperature of a resin binder which is contained in the ceramic green sheets in which the green sheets are disposed.


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