The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 2008
Filed:
Apr. 12, 2007
Applicants:
Eunsang Ji, Kumi, KR;
Kyungmoo Lee, Kumi, KR;
Inventors:
Eunsang Ji, Kumi, KR;
Kyungmoo Lee, Kumi, KR;
Assignee:
Siltron Inc., Kumi, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B28D 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method for slicing an ingot may improve nanotopography at a surface of a wafer. In the method, an ingot is sliced into a plurality of wafers via a slurry while slurry is supplied to a moving wire. A first wire to form a first slicing portion at the wafer firstly slices one side of the ingot. A second wire secondly slices the remaining portion of the ingot to form a second slicing portion continued from the first slicing portion, wherein the first wire has a smaller diameter than that of the second wire.