The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 06, 2008
Filed:
Feb. 07, 2005
Yoshitaka Sasaki, Milpitas, CA (US);
Hiroyuki Itoh, Milpitas, CA (US);
Dong-hong LI, Milpitas, CA (US);
Hironori Araki, Milpitas, CA (US);
Kazuo Ishizaki, Milpitas, CA (US);
Yoshitaka Sasaki, Milpitas, CA (US);
Hiroyuki Itoh, Milpitas, CA (US);
Dong-Hong Li, Milpitas, CA (US);
Hironori Araki, Milpitas, CA (US);
Kazuo Ishizaki, Milpitas, CA (US);
Headway Technologies, Inc., Milpitas, CA (US);
Abstract
A method of manufacturing magnetic heads comprises the step of: fabricating a magnetic head substructure by forming components of a plurality of magnetic heads on a single substrate, wherein a plurality of rows of pre-head portions that will be the respective magnetic heads later are aligned in the substructure; and fabricating the magnetic heads by separating the pre-head portions from one another through cutting the substructure. In the substructure first resistor elements and second resistor elements are formed. Each of the first resistor elements has a resistance that varies depending on the location of an end of an MR element located in a medium facing surface along the direction orthogonal to the medium facing surface. Each of the second resistor elements has a resistance that varies depending on the location of an end face of a track width defining portion located in the medium facing surface along the direction orthogonal to the medium facing surface. The medium facing surfaces are formed while monitoring the resistance values of the first and second resistor elements.