The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 06, 2008

Filed:

Aug. 29, 2006
Applicants:

Hsin-hung Lin, Hsinchu Hsiang, TW;

Shih-cheng Wu, Hsinchu Hsiang, TW;

Wei-cheng Ku, Hsinchu Hsiang, TW;

Chien-liang Chen, Hsinchu Hsiang, TW;

Ming-chi Chen, Hsinchu Hsiang, TW;

Hendra Sudin, Hsinchu Hsiang, TW;

Inventors:

Hsin-Hung Lin, Hsinchu Hsiang, TW;

Shih-Cheng Wu, Hsinchu Hsiang, TW;

Wei-Cheng Ku, Hsinchu Hsiang, TW;

Chien-Liang Chen, Hsinchu Hsiang, TW;

Ming-Chi Chen, Hsinchu Hsiang, TW;

Hendra Sudin, Hsinchu Hsiang, TW;

Assignee:

MJC Probe Incorporation, Chu-Pei, Hsinchu Hsiang, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/02 (2006.01); G01R 31/26 (2006.01);
U.S. Cl.
CPC ...
Abstract

A vertical-type probe card includes a circuit board, which has signal circuits and grounding circuits arranged in such a manner that each signal circuit is disposed in parallel and adjacent to one grounding circuit and kept a predetermined distance from the grounding circuit, and a probe assembly, which is arranged at the bottom side of the circuit board and has an upper guide plate, a lower guide plate, a conducting layer provided on the lower guide plate, a plurality of signal probes respectively electrically connected to the signal circuits and adjacent to a plurality of compensation probes, and at least one grounding probe electrically connected to the grounding circuits in a manner that the signal, compensation and grounding probes are vertically inserted through the upper and lower guide plates, and the conducting layer is conducted with the compensation probe and the grounding probe while electrically insulated to the signal probe.


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