The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 06, 2008
Filed:
May. 27, 2004
John William Osenbach, Kutztown, PA (US);
Brian Dale Potteiger, Reading, PA (US);
Richard Lawrence Shook, Fogelsville, PA (US);
Brian Thomas Vaccaro, Mertztown, PA (US);
John William Osenbach, Kutztown, PA (US);
Brian Dale Potteiger, Reading, PA (US);
Richard Lawrence Shook, Fogelsville, PA (US);
Brian Thomas Vaccaro, Mertztown, PA (US);
Agere Systems Inc., Allentown, PA (US);
Abstract
A process includes annealing one or more plated conductive leads at a predetermined temperature. The one or more plated conductive leads are plated with one or more layers, where each layer comprises a material. The predetermined temperature is greater than or equal to approximately a melting point of one of the materials. The annealing can reduce growth formations, such as whiskers, on the one or more conductive leads. Lead frames and other devices having plated conductive leads may be subjected to the process, and the resultant plated conductive leads will have fewer growth formations than plated conductive leads not subjected to the process. The plated conductive leads may be trimmed and formed prior to or after the anneal.