The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 06, 2008
Filed:
Aug. 10, 2005
Applicant:
Soichi Yamashita, Kawasaki, JP;
Inventor:
Soichi Yamashita, Kawasaki, JP;
Assignee:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor device is provided which includes a first semiconductor chip, a substrate onto which the first semiconductor chip is flip-chip bonded and on which a concave is formed along one side of the first semiconductor chip which is flip-chip bonded, a second semiconductor chip which is flip-chip bonded onto a portion on the substrate opposite the first semiconductor chip across the concave on the substrate, and a resin applied to spaces between the substrate and the first and second semiconductor chips.