The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 06, 2008
Filed:
Oct. 17, 2005
Michael Scott Kranz, Madison, AL (US);
Robert Faye Elliott, Madison, AL (US);
Michael Ray Whitley, Madison, AL (US);
Marty Ray Williams, Huntsville, AL (US);
Philip John Reiner, Huntsville, AL (US);
Michael Scott Kranz, Madison, AL (US);
Robert Faye Elliott, Madison, AL (US);
Michael Ray Whitley, Madison, AL (US);
Marty Ray Williams, Huntsville, AL (US);
Philip John Reiner, Huntsville, AL (US);
Morgan Research Corporation, Huntsville, AL (US);
Abstract
The MEMS Sensor Suite on a Chip provides the capability, monolithically integrated onto one MEMS chip, to sense temperature, humidity, and two axes of acceleration. The device incorporates a MEMS accelerometer, a MEMS humidity sensor, and a MEMS temperature sensor on one chip. These individual devices incorporate proof masses, suspensions, humidity sensitive capacitors, and temperature sensitive resistors (thermistors) all fabricated in a common fabrication process that allows them to be integrated onto one micromachined chip. The device can be fabricated in a simple micromachining process that allows its size to be miniaturized for embedded and portable applications. During operation, the sensor suite chip monitors temperature levels, humidity levels, and acceleration levels in two axes. External circuitry allows sensor readout, range selection, and signal processing.