The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 06, 2008

Filed:

Sep. 09, 2003
Applicant:

Norikazu Sugaya, Yamanashi, JP;

Inventor:

Norikazu Sugaya, Yamanashi, JP;

Assignee:

Kitz Corporation, Chiba, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B08B 3/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A technique is provided to precludes elution of the nickel by infallibly removing the nickel adhering to the inner surface of plumbing hardware, realize a treatment for efficient (treating temperature, treating duration, etc.) preclusion of both or either of lead and nickel and perform a neutralizing treatment on the varying fluid used in the treatment for precluding elution, thereby rendering the fluid usable as industrial water, permitting a generous cut in cost and allowing thorough observance of the influence on the environment. A method for precluding elution of lead and nickel from a plumbing device made of a copper alloy that includes a valve and a tube coupling, includes washing at least a liquid-contacting part of the plumbing device of a copper alloy containing both or either of lead and nickel with a cleaning fluid incorporating therein nitric acid and hydrochloric acid as an inhibitor under conditions of a temperature and a duration permitting effective removal of both or either of lead and nickel, thereby performing at least one of deleading treatment and nickel-removing treatment for a surface of the liquid-contacting part and causing the hydrochloric acid to form a coating film on the surface of the liquid-contacting part to thereby effectively precluding elution of both or either of the lead and nickel from the surface of the liquid-contacting part in the presence of the coating layer.


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