The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 06, 2008

Filed:

Jul. 12, 2005
Applicants:

Francis Chee-shuen Lee, Hsinchu, TW;

Jui-hua HU, Taiping, TW;

Jia-lin Chen, Hsinchu, TW;

Wei-fu Lai, Taichung, TW;

Inventors:

Francis Chee-Shuen Lee, Hsinchu, TW;

Jui-Hua Hu, Taiping, TW;

Jia-Lin Chen, Hsinchu, TW;

Wei-Fu Lai, Taichung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/05 (2006.01);
U.S. Cl.
CPC ...
Abstract

An inkjet printhead chip includes a substrate, transistors, isolation structures, a dielectric layer, a resistive layer and conductive sections. Each transistor includes a gate, a source, a drain and a gate oxide disposed between the gate and the substrate. The isolation structures are on the substrate surface and isolate the transistors. The dielectric layer covers the transistors and the isolation structures, and has openings exposed the source and the drain. Several heating regions are in the resistive layer that is on the dielectric layer. In the conductive sections, the first conductive section is on the resistive layer and exposes the heating regions for forming several heating devices. Each heating device has resistance less than 95 ohm and power density less than 2 GW/m; the second conductive section and the third conductive section are electrically coupled to the drain and the source through the openings of the dielectric layer respectively.


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