The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2008
Filed:
May. 26, 2006
Yoshitaka Aiba, Kawasaki, JP;
Yoshitaka Aiba, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
To provide a semiconductor device with high performance and reliability, in which peeling off an interconnection layer caused due to peeling off of a resin film at a land part is suppressed and thus electrical break down is prevented, and an efficient method for manufacturing the semiconductor device. The semiconductor device includes a semiconductor substrate (e.g., a silicon wafer); an insulating filmformed on the semiconductor substratea conductive layerformed on the insulating filmthe conductive layerformed of an interconnection partand a land partwhich connects the interconnection partto an external terminaland a resin filmcovering the conductive layerwherein the resin filmis in contact with the insulating filmat least at a part of the land partby passing through the conductive layer