The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2008
Filed:
May. 01, 2006
Kee Yean NG, Penang, MY;
Hui Peng Koay, Penang, MY;
Chiau Jin Lee, Penang, MY;
Kheng Leng Tan, Penang, MY;
Wei Liam Loo, Penang, MY;
Keat Chuan NG, Penang, MY;
Alzar Abdul Karim Norfidathul, Seberang Perai, MY;
Kee Yean Ng, Penang, MY;
Hui Peng Koay, Penang, MY;
Chiau Jin Lee, Penang, MY;
Kheng Leng Tan, Penang, MY;
Wei Liam Loo, Penang, MY;
Keat Chuan Ng, Penang, MY;
Alzar Abdul Karim Norfidathul, Seberang Perai, MY;
Avago Technologies General IP Pte Ltd, Singapore, SG;
Abstract
A packaged circuit and method for packaging an integrated circuit are disclosed. The packaged circuit has a lead frame, an integrated circuit chip, and an encapsulating layer. The lead frame has first and second sections, the first section including a lateral portion, a chip mounting area and a first extension. The integrated circuit chip is mounted in the chip mounting area and is in thermal contact with the chip mounting area. The encapsulating layer has top, bottom, and first and second side surfaces. The first extension is bent to provide a first heat path from the chip mounting area to the bottom surface. The heat path connects the heat chip mounting area to the bottom surface without passing through the first and second side surfaces and provides a heat path that has less thermal resistance than the heat path through either the lateral portion or the second section.