The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2008
Filed:
Jul. 27, 2005
Tetsuo Nishida, Suwa, JP;
Hajime Onishi, Chino, JP;
Tetsuo Nishida, Suwa, JP;
Hajime Onishi, Chino, JP;
Seiko Epson Corporation, Tokyo, JP;
Abstract
To simplify the burn-in process and reduce its cost for a surface-emitting type wafer and its manufacturing method, and for a burn-in method for a surface-emitting type wafer. A surface-emitting type wafer includes a substrateand a plurality of surface-emitting type elementsformed above the substrate. Each of the surface-emitting type elementsincludes a light emitting element section, first and second electrodesfor driving the light emitting element section, and a rectification element section. The rectification element sectionis connected in parallel between the first and second electrodes, and has a rectification action in a reverse direction with respect to the light emitting element section. The plurality of surface-emitting type elementsare connected in series in a direction in which forward directions of the respective light emitting element sectionscoincide with one another.