The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 29, 2008

Filed:

Jan. 03, 2006
Applicants:

Tatsuya Miya, Kanagawa, JP;

Kazuharu Kimura, Kanagawa, JP;

Inventors:

Tatsuya Miya, Kanagawa, JP;

Kazuharu Kimura, Kanagawa, JP;

Assignee:

NEC Electronics Corporation, Kawasaki, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
Abstract

A board for high frequency device includes a plurality of electrode terminals connected to an electronic component or another electronic circuit board by flowable conducting material such as solder, and grooves formed in an electrode terminal of the plurality of electrode terminals and capable of accumulating solder or the like. Specifically, a high frequency component is mounted on the front surface of the high frequency device board, and the plurality of electrode terminals are formed on the rear surface of the high frequency device board. A ground electrode terminal included in the plurality of electrode terminals is formed at the center of the rear surface of the high frequency device board and connected to a ground. The grooves for accumulating solder or the like are formed in the ground electrode terminal. This reduces the possibility of short-circuit between adjacent electrode terminals due to the flowable conducting material such as solder.


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