The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2008
Filed:
May. 04, 2005
Haochuan Wang, South Pasadena, CA (US);
Ali Mehrabi, Glendale, CA (US);
Kouroche Kian, Altadena, CA (US);
Dave N. Edwards, La Canada, CA (US);
Akiko Tanabe, Los Angeles, CA (US);
Mark Licon, Diamond Bar, CA (US);
Jay Akhave, Claremont, CA (US);
Haochuan Wang, South Pasadena, CA (US);
Ali Mehrabi, Glendale, CA (US);
Kouroche Kian, Altadena, CA (US);
Dave N. Edwards, La Canada, CA (US);
Akiko Tanabe, Los Angeles, CA (US);
Mark Licon, Diamond Bar, CA (US);
Jay Akhave, Claremont, CA (US);
Avery Dennison Corporation, Pasadena, CA (US);
Abstract
A process is disclosed for creating semiconductor devices such as RFID assemblies wherein an array of dies mounted to a substrate is spaced apart at a first pitch, and the substrate is removed after the positions of the dies in the array is fixed by a solidifiable substance. The solidifiable substance is then removed without changing the relative positions of the dies in the array. All or a selected portion of the array of dies is then electrically attached to a plurality of straps or interposers arranged in a corresponding array. The spacing, or pitch, between the dies in the die array may be changed before or after the substrate is removed to match the pitch of the straps or interposers in the corresponding array. An RFID device created using the process inventive is also disclosed.