The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2008
Filed:
Sep. 16, 2004
Shouhei Kozakai, Gunma-ken, JP;
Nobuhiro Ichiroku, Gunma-ken, JP;
Akio Suzuki, Gunma-ken, JP;
Toshio Shiobara, Gunma-ken, JP;
Shouhei Kozakai, Gunma-ken, JP;
Nobuhiro Ichiroku, Gunma-ken, JP;
Akio Suzuki, Gunma-ken, JP;
Toshio Shiobara, Gunma-ken, JP;
Shin-Etsu Chemical Co., Ltd., Tokyo, JP;
Abstract
An adhesive composition is provided comprising (A) a polyimide resin containing a diorganopolysiloxane linkage having vinyl groups as organic substituent groups on the backbone, (B) an epoxy resin, and (C) an epoxy resin-curing catalyst. An adhesive film prepared from the adhesive composition has a high bond strength to various substrates and to encapsulating resins when thermocompression bonded and heat cured thereto, and possesses a low modulus of elasticity and high heat resistance, ensuring manufacture of resin packaged semiconductor devices with high reliability.