The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2008
Filed:
Feb. 28, 2007
Applicants:
David E. Berkstresser, Los Gatos, CA (US);
Jerry J. Berkstresser, San Jose, CA (US);
Jino Park, San Jose, CA (US);
In-kwon Jeong, Cupertino, CA (US);
Inventors:
David E. Berkstresser, Los Gatos, CA (US);
Jerry J. Berkstresser, San Jose, CA (US);
Jino Park, San Jose, CA (US);
In-Kwon Jeong, Cupertino, CA (US);
Assignee:
Inopla Inc., San Jose, CA (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B24B 7/22 (2006.01);
U.S. Cl.
CPC ...
Abstract
A polishing head and method for handling and polishing semiconductor wafers uses a base structure with at least one recess region and an outer flexible membrane that can conform to the at least one recess region to form at least one depression to hold a semiconductor wafer onto the outer flexible membrane when suction is applied to the at least one depression.