The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2008
Filed:
Apr. 11, 2006
Applicants:
Timothy Ehret, Medford, NJ (US);
Bradley M. Smith, Mount Laurel, NJ (US);
Inventors:
Timothy Ehret, Medford, NJ (US);
Bradley M. Smith, Mount Laurel, NJ (US);
Assignee:
Lockheed Martin Corporation, Bethesda, MD (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01C 17/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
An encapsulated heat pipe is made by placing a removable elongated solid partially within a mold, filling the mold with a solid dielectric material, and removing the elongated solid from the dielectric material defining an elongated cavity that extends within the solid dielectric material. Next, a wick material is inserted into the periphery of the elongated cavity, then a coolant liquid is inserted into the elongated cavity and the open end of the elongated cavity is sealed.