The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 22, 2008
Filed:
Jul. 24, 2003
Kenichi Hayashi, Tokyo, JP;
Hisashi Kawafuji, Fukuoka, JP;
Junichi Murai, Tokyo, JP;
Goro Izuta, Tokyo, JP;
Kenichi Hayashi, Tokyo, JP;
Hisashi Kawafuji, Fukuoka, JP;
Junichi Murai, Tokyo, JP;
Goro Izuta, Tokyo, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
In a semiconductor device (), semiconductor elements () and () are mounted on a lead frame () having leads (). The semiconductor elements () and () are connected with the leads () by metallic wires () and (). The semiconductor device () also has a heat sink (). The members () to () are sealed with a plastic package (). The leads () are exposed outward. Each of the end leads () to () has a wide first lead portion, a narrow second lead portion, a third lead portion to be inserted into an external substrate, and a protruding gap-controlling portion () for keeping the gap between the semiconductor device () and the external substrate constant. Because the heat resistance from the leads () to the plastic package () increases, the temperature-rise property of the lead is improved so that the solderability is improved.