The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 22, 2008

Filed:

Dec. 30, 2004
Applicants:

William R. Freeman, Castro Valley, CA (US);

Hong Jin Jiang, Singapore, SG;

Inventors:

William R. Freeman, Castro Valley, CA (US);

Hong Jin Jiang, Singapore, SG;

Assignee:

Finisar Corporation, Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract

Exemplary embodiments of the present invention illustrate methods to electrically connect multiple layers of a substrate. A first and second layer each has at least one electrical trace on a surface thereof. The substrate includes an interposer structure attached to the second layer and separating the first and second layers on at least a portion of a perimeter of the first and second layers. The method includes a steps for forming a via in the first layer, placing a first electrically conductive substance in the via, placing a second electrically conductive substance on the second layer adjacent said via, and heating an area around said via and said second electrically conductive substance until said first and second electrically conductive substances at least partially melt to form the electrical connection.


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