The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 22, 2008
Filed:
Dec. 21, 2005
Gregory J. Dunn, Arlington Heights, IL (US);
Remy J. Chelini, Crystal Lake, IL (US);
Robert T. Croswell, Hanover Park, IL (US);
Philip M. Lessner, Newberry, SC (US);
Michael D. Prevallet, Mauldin, SC (US);
John D. Prymak, Greer, SC (US);
Gregory J. Dunn, Arlington Heights, IL (US);
Remy J. Chelini, Crystal Lake, IL (US);
Robert T. Croswell, Hanover Park, IL (US);
Philip M. Lessner, Newberry, SC (US);
Michael D. Prevallet, Mauldin, SC (US);
John D. Prymak, Greer, SC (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
Embedded capacitors comprise a bimetal foil () that includes a first copper layer () and an aluminum layer () on the first copper layer. The aluminum layer has a smooth side adjacent the first copper layer and a high surface area textured side () opposite the first copper layer. The bimetal foil further includes an aluminum oxide layer () on the high surface area textured side of the aluminum layer, a conductive polymerlayer () on the aluminum oxide layer, and a second copper layer () overlying the aluminum oxide layer. The bimetal foil may be embedded in a circuit board () to form high value embedded capacitors.