The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 22, 2008
Filed:
Jan. 30, 2002
Hideo Tanigawa, Osaka, JP;
Yasuo Matoba, Osaka, JP;
Tetsuyuki Saika, Osaka, JP;
Takashi Matsuo, Osaka, JP;
Kazunori Yokoyama, Osaka, JP;
Hideo Tanigawa, Osaka, JP;
Yasuo Matoba, Osaka, JP;
Tetsuyuki Saika, Osaka, JP;
Takashi Matsuo, Osaka, JP;
Kazunori Yokoyama, Osaka, JP;
National Institute of Advanced Industrial Science and Technology, Tokyo, JP;
Other;
Daiso, Co., Ltd., Osaka, JP;
Abstract
An object of the present invention is to provide a hologram recording material composition comprising a radical polymerizable compound being solid at an ordinary temperature and having a 9,9-diarylflourene skeleton, a polymeric binder and a plasticizer, the composition being excellent in transparency and diffraction efficiency, which are characteristics required for a hologram. The hologram recording material composition comprises a thermoplastic resin (A) which is soluble in a solvent, a radical polymerizable compound (B) which is solid at an ordinary temperature and at ordinary pressure and has the 9,9-diarylfluorene skeleton and at least one radical polymerizable unsaturated double bond, a plasticizer (C) and a photopolymerization initiator (D). A weight percentage ratio of the thermoplastic resin (A), the radical polymerizable compound (B) and the plasticizer (C), (A):(B):(C) is 10 to 80:10 to 80:10 to 80. A refractive index of the radical polymerizable compound (B) is larger than a weighted mean of that of the thermoplastic resin (A) and that of the plasticizer (C).