The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 15, 2008

Filed:

Jan. 20, 2006
Applicants:

Keith Aubin, Freeville, NY (US);

Bojan (Rob) Ilic, Ithaca, NY (US);

Maxim Zalalutdinov, Silver Spring, MD (US);

Robert B. Reichenbach, Ithaca, NY (US);

Jeevak M. Parpia, Ithaca, NY (US);

Harold G. Craighead, Ithaca, NY (US);

Inventors:

Keith Aubin, Freeville, NY (US);

Bojan (Rob) Ilic, Ithaca, NY (US);

Maxim Zalalutdinov, Silver Spring, MD (US);

Robert B. Reichenbach, Ithaca, NY (US);

Jeevak M. Parpia, Ithaca, NY (US);

Harold G. Craighead, Ithaca, NY (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03L 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The temperature of a remote portion of device having a microelectromechanical oscillator is modulated to create oscillation of the oscillators. In one embodiment, a localized heat source is placed on a device layer of a multilayered stack, consisting of device, sacrificial and substrate layers. The localized heat source may be a laser beam in one embodiment. The oscillator is supported by the device layer and may be formed in the device layer in various embodiments. The oscillator may be spaced apart from the localized heat source.


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