The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 15, 2008

Filed:

Dec. 30, 2003
Applicants:

Hiroyuki Shoji, Nara, JP;

Hideya Takakura, Nara, JP;

Kazuo Kusuda, Nara, JP;

Inventors:

Hiroyuki Shoji, Nara, JP;

Hideya Takakura, Nara, JP;

Kazuo Kusuda, Nara, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A photo-coupler semiconductor device includes first and second planar lead frames each having a main portion and a distal portion, a light emitting element and a light receiving element respectively mounted on upper surfaces of the distal portions of the first and second lead frames, a light-transmitting resin member which covers the light emitting element and the light receiving element, and supports the distal portions of the first and second lead frames in spaced opposed relation with the light emitting element and the light receiving element being mounted on the upper surfaces of the distal portions so that the main portions of the first and second lead frames are located in coplanar relation, and a opaque resin member which covers the light-transmitting resin member, and supports the main portions of the first and second lead frames. The light-transmitting resin member and the opaque resin member are each composed of an epoxy resin as a base resin.


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