The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 15, 2008

Filed:

Apr. 07, 2004
Applicants:

Chien-hung Liu, Hsinchu, TW;

Ming-huan Yang, Hsinchu, TW;

Jane Chang, Hsinchu, TW;

Chun-jung Chen, Hsinchu, TW;

Chao-kai Cheng, Hsinchu, TW;

Kou-chen Liu, Taoyuan, TW;

Inventors:

Chien-Hung Liu, Hsinchu, TW;

Ming-Huan Yang, Hsinchu, TW;

Jane Chang, Hsinchu, TW;

Chun-Jung Chen, Hsinchu, TW;

Chao-Kai Cheng, Hsinchu, TW;

Kou-Chen Liu, Taoyuan, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of forming a conductive via plug is disclosed. The conductive via plug is formed by printing a solution comprising a solvent with insulating material dissolve capability and a conductive material by an inkjet method. The formed conductive via plug has a low resistivity and thus may serve as an electrical connection between two separate conductive layers. This manufacturing method of the conductive via plug may achieve simultaneously deposition, patterning and etching purposes, which significantly simplifies the manufacturing process.


Find Patent Forward Citations

Loading…