The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 15, 2008
Filed:
Oct. 06, 2005
BO Gu, North Andover, MA (US);
Joseph V. Lento, Methuen, MA (US);
Jonathan S. Ehrmann, Sudbury, MA (US);
Bruce L. Couch, North Attleboro, MA (US);
Yun Fee Chu, Natick, MA (US);
Shepard D. Johnson, Andover, MA (US);
Bo Gu, North Andover, MA (US);
Joseph V. Lento, Methuen, MA (US);
Jonathan S. Ehrmann, Sudbury, MA (US);
Bruce L. Couch, North Attleboro, MA (US);
Yun Fee Chu, Natick, MA (US);
Shepard D. Johnson, Andover, MA (US);
GSI Group Corporation, Billerica, MA (US);
Abstract
A method, system and scan lens system are provided for high-speed, laser-based, precise laser trimming at least one electrical element. The method includes generating a pulsed laser output having one or more laser pulses at a repetition rate. Each laser pulse has a pulse energy, a laser wavelength within a range of laser wavelengths, and a pulse duration. The method further includes selectively irradiating the at least one electrical element with the one or more laser pulses focused into at least one spot having a non-uniform intensity profile along a direction and a spot diameter as small as about 6 microns to about 15 microns so as to cause the one or more laser pulses to selectively remove material from the at least one element and laser trim the at least one element while avoiding substantial microcracking within the at least one element. The wavelength is short enough to produce desired short-wavelength benefits of small spot size, tight tolerance and high absorption, but not so short so as to cause microcracking.