The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 15, 2008
Filed:
Oct. 13, 2005
Alex Hong, Kaohsiung, TW;
I Yu Huang, Kaohsiung, TW;
Chih Hung Wang, Kaohsiung, TW;
Sunonwealth Electric Machine Industry Co., Ltd., Kaohsiung, TW;
Abstract
The invention presents a novel polyimide-based thin film self-assembly technology, including five process steps described as follows: (1) deposits a sacrificial layer and a low-stress microstructure layer on a silicon substrate; (2) patterns and etches the low-stress microstructure layer to provide a stationary part and a movable part of the microstructure; (3) coats a photosensitive polyimide thin film as elastic joint of the microstructure layer and defines the shape by using photolithography technique; (4) releases the sacrificial layer beneath the movable part of microstructure layer by wet etching; (5) lastly proceeds the reflow process of polyimide to result in the contraction of the elastic joint further to rotate and lift the movable part in completion of the self-assembly of the microstructure. As the invention can be extensively applied to a myriad of miniaturizing industries, it can solve all the drawbacks of the prior art manufacturing process and miniaturization.