The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 15, 2008
Filed:
Sep. 03, 2004
Osamu Shindo, Tokyo, JP;
Toru Mizuno, Tokyo, JP;
Youichi Andoh, Tokyo, JP;
Satoshi Yamaguchi, Tokyo, JP;
Osamu Shindo, Tokyo, JP;
Toru Mizuno, Tokyo, JP;
Youichi Andoh, Tokyo, JP;
Satoshi Yamaguchi, Tokyo, JP;
TDK Corporation, Tokyo, JP;
SAE Magnetics (H.K.) Ltd., Shatin, HK;
Abstract
After introducing a solder ball from a hopper into a receiving hole of a ball separator, the ball separator is slid between blocks, and the solder ball is sent out to a portion outside of the blocks. By suctioning the solder ball from within a projected region on a lower block which is situated inside of the receiving hole at a time when the solder ball is taken into the receiving hole and surrounds a rolling trajectory of the solder ball that has been taken into the receiving hole, the solder ball is forcibly introduced into the receiving hole.