The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 15, 2008
Filed:
Apr. 15, 2003
Masahiro Furusawa, Chino, JP;
Takashi Hashimoto, Chino, JP;
Masahiro Furusawa, Chino, JP;
Takashi Hashimoto, Chino, JP;
Seiko Epson Corporation, , JP;
Abstract
A method for forming a conductive layer pattern by selectively depositing droplets containing conductive material onto a porous receiving layer. Much of the conductive material is left on the surface for forming wiring patterns but some of it permeates the pockets or voids in the receiving layer and can be used, for example, to provide interlayer connections in laminated wiring boards. Preferably, the conductive material is provided by fine conductive particles, organometallic compounds or mixtures thereof.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile