The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2008
Filed:
Jun. 08, 2005
Ryota Suzuki, Sagamihara, JP;
Taihei Nakada, Yokosuka, JP;
Tsuyoshi Kumamoto, Yokohama, JP;
Yuusuke Yamashita, Yokohama, JP;
Ryota Suzuki, Sagamihara, JP;
Taihei Nakada, Yokosuka, JP;
Tsuyoshi Kumamoto, Yokohama, JP;
Yuusuke Yamashita, Yokohama, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
A high frequency multilayer integrated circuit is provided with: a multilayer board including n earth conductor layers (n: integer of two or more than two) and (n-1) dielectric layers each arranged between adjacent earth conductor layers; a first high frequency circuit disposed in one of the most outside earth conductor layers of the multilayer board; a first power-supply/control circuit disposed in this most outside earth conductor layer; a second high frequency circuit disposed in at least one of the dielectric layers and connected to the first high frequency circuit in the multilayer board; a second power-supply/control circuit disposed in another one of the most outside earth conductor layers of the multilayer board; and a third power-supply/control circuit disposed in at least one of the dielectric layers at a portion at which the second high frequency circuit does not exist, the third power-supply/control circuit being connected to the first and second power-supply/control circuits.