The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2008
Filed:
Mar. 15, 2006
Gerold Gruendler, Regensburg, DE;
Juergen Hoegerl, Regensburg, DE;
Thomas Killer, Hohenschambach, DE;
Volker Strutz, Tegernheim, DE;
Erich Syri, München, DE;
Gerold Gruendler, Regensburg, DE;
Juergen Hoegerl, Regensburg, DE;
Thomas Killer, Hohenschambach, DE;
Volker Strutz, Tegernheim, DE;
Erich Syri, München, DE;
Infineon Technologies, AG, Neubiberg, DE;
Abstract
A heat sink for surface-mounted semiconductor devices is provided on a superordinate circuit board of an electronic module. The heat sink includes a three-dimensionally structured thermally conductive plate with a press-on region and snap-action hooks. The snap-action hooks are arranged approximately at right angles with respect to the press-on region and are spring-elastically connected to the press-on region of the heat sink via a spring-elastic connecting region of the heat sink. The snap-action hooks engage with edge regions of a thermally conductive coupling plate with the press-on region generating pressure. The coupling plate is fixed to a rear side of a semiconductor chip of the surface-mounted semiconductor device.