The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2008
Filed:
Nov. 08, 2002
Hideyuki Emoto, Tokyo, JP;
Masahiro Ibukiyama, Tokyo, JP;
Isao Sugimoto, Tokyo, JP;
Manabu Uto, Tokyo, JP;
Hideyuki Emoto, Tokyo, JP;
Masahiro Ibukiyama, Tokyo, JP;
Isao Sugimoto, Tokyo, JP;
Manabu Uto, Tokyo, JP;
Denki Kagaku Kogyo Kabushiki Kaisha, Tokyo, JP;
Abstract
A module is provided that has high reliability in the junction between a ceramic circuit board and a heat sink, undergoes small changes in shape and warp of a module structure comprising a ceramic circuit board and a metal heat sink event under a temperature history during power module assembly and power module actual use, eliminates an unfavorableness during power module assembly, and maintains high reliability over a long period of time. A module structure characterized in that in a module member formed by bonding the ceramic circuit board to the metal heat sink via a metal plate (A) the main component of which is aluminum, the metal plate (A) has a thickness of 400 μm or more and 1,200 μm or less.