The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2008
Filed:
Sep. 14, 2005
Richard L. Pierson, Jr., Thousand Oaks, CA (US);
James Chingwei LI, San Diego, CA (US);
Berinder P. S. Brar, Newbury Park, CA (US);
John A. Higgins, Westlake Village, CA (US);
Richard L. Pierson, Jr., Thousand Oaks, CA (US);
James Chingwei Li, San Diego, CA (US);
Berinder P. S. Brar, Newbury Park, CA (US);
John A. Higgins, Westlake Village, CA (US);
Teledyne Licensing, LLC, Thousand Oaks, CA (US);
Abstract
A method for fabricating an HBT is disclosed, wherein successive emitter, base, collector and sub-collector epitaxial layers are deposited on a substrate, with the substrate being adjacent to the sub-collector layer. The epitaxial layers are etched to provide locations for contact metals and emitter, base and contact metals are deposited on the emitter, base and sub-collector epitaxial layers, respectively. A self-alignment material is deposited on the surface of the substrate around the epitaxial layers and a planarization material is deposited on and covers the top surface of the HBT. The planarization material is then etched so it has a planar surface about the same level as the surface of the self-alignment material and the contact metals protrude from the planar surface. The planar metals are then deposited over the protruding portions of the contact metals.