The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2008
Filed:
Dec. 20, 2002
H. Bernhard Pogge, Hopewell Junction, NY (US);
Roy Yu, Poughkeepsie, NY (US);
H. Bernhard Pogge, Hopewell Junction, NY (US);
Roy Yu, Poughkeepsie, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method is described for fabricating a three-dimensional integrated device including a plurality of vertically stacked and interconnected wafers. Wafers () are bonded together using bonding layers () of thermoplastic material such as polyimide; electrical connections are realized by vias () in the wafers connected to studs (). The studs connect to openings () having a lateral dimension larger than that of the vias at the front surfaces of the wafers. Furthermore, the vias in the respective wafers need not extend vertically from the front surface to the back surface of the wafers. A conducting body () provided in the wafer beneath the device region and extending laterally, may connect the via with the matallized opening () in the back surface. Accordingly, the conducting path through the wafer may be led underneath the devices thereof. Additional connections may be made between openings () and studs () to form vertical heat conduction pathways between the wafers.