The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2008
Filed:
Feb. 18, 2005
Frank E. Anderson, Sadieville, KY (US);
Richard E. Corley, Jr., Richmond, KY (US);
Paul T. Spivey, Lexington, KY (US);
Carl E. Sullivan, Stamping Ground, KY (US);
Frank E. Anderson, Sadieville, KY (US);
Richard E. Corley, Jr., Richmond, KY (US);
Paul T. Spivey, Lexington, KY (US);
Carl E. Sullivan, Stamping Ground, KY (US);
Lexmark International, Inc., Lexington, KY (US);
Abstract
Methods of connecting a circuit device to a semiconductor substrate and micro-fluid ejection devices made by the methods. One method includes printing an elongate strip of an electrically conductive fluid to electrically interconnect a first contact pad on a semiconductor substrate containing fluid ejection actuator devices with a second contact pad on an electrical trace circuit, wherein the electrical trace circuit is disposed adjacent to and spaced-apart from the semiconductor substrate. The electrically conductive fluid contains a liquid component and a conductive particle component. The liquid component is removed from the conductive particle component to provide a solid elongate strip of conductive material interconnecting the first contact pad and the second contact pad.