The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2008
Filed:
Nov. 26, 2002
Tatsuo Yamaguchi, Tokyo, JP;
Shinji Miwa, Kawasaki, JP;
Fumio Asada, Kawasaki, JP;
Kenichi Hiraki, Shiojiri, JP;
Naoki Minorikawa, Naka-gun, JP;
Tatsuo Yamaguchi, Tokyo, JP;
Shinji Miwa, Kawasaki, JP;
Fumio Asada, Kawasaki, JP;
Kenichi Hiraki, Shiojiri, JP;
Naoki Minorikawa, Naka-gun, JP;
Japan Polyolefins Co., Ltd., Tokyo, JP;
Abstract
An object of the present invention is to provide an adhesive resin composition which displays excellent adhesive strength on bonding to a barrier material, during initial adhesion, durable adhesion, and even after soak in fuel oil, and which also has excellent moldability. Furthermore, another object of the present is to provide an adhesive resin composition which when recycled, displays good compatible in a regrind layer with polyethylene resins and barrier materials such as saponified products of ethylene-vinyl acetate copolymers or polyamide based resins, and which is consequently capable of suppressing deterioration in the low temperature impact resistance of a multi-layer vessel containing a regrind layer. In order to achieve these objects, the present invention provides an adhesive resin composition (C) comprising (A) 100 to 5% by mass of a modified polyethylene in which an unsaturated carboxylic acid and/or an unsaturated carboxylic acid derivative unit is grafted to a high molecular weight polyethylene with a melt flow rate (MFR: temperature 190° C., loading 2.16 kg) of 0.1 to 2.0 g/10 minutes, and a density of 0.91 to 0.96 g/cm, and (B) 0 to 95% by mass of an unmodified polyethylene with a melt flow rate (MFR: temperature 190° C., loading 2.16 kg) of 0.1 to 20 g/10 minutes, and a density of 0.86 to 0.96 g/cm, wherein the density of the adhesive resin composition (C) is 0.925 to 0.940 g/cm, the content of the unsaturated carboxylic acid and/or unsaturated carboxylic acid derivative unit incorporated therein is at least 0.09% by mass, and the melt flow rate (MFR: temperature 190° C., loading 2.16 kg) is from 0.1 to 2 g/10 minutes.