The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 08, 2008

Filed:

Dec. 26, 2003
Applicants:

Howard H. Liebermann, Succasunna, NJ (US);

William C. Lacourse, Alfred, NY (US);

James E. O'keefe, Jr., Westwood, NJ (US);

Inventors:

Howard H. Liebermann, Succasunna, NJ (US);

William C. LaCourse, Alfred, NY (US);

James E. O'Keefe, Jr., Westwood, NJ (US);

Assignee:

Demodulation, LLC, Westwood, NJ (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A metallic glass-coated wire is formed by drawing a hollow glass fiber from a container in which molten alloy is entrained and solidified. Interference stresses extant between the glass coating and the alloy core of the wire are produced by systematically controlling thickness and mechanical elastic properties of the glass. The interference stress is tailored by selection of glass thickness and chemistry to optimize wire drawing process conditions, such as drawing temperature and strain rate. In addition, the interference stress is especially tailored to assure physical integrity of the glass-alloy composite wire product. Local property variations along the wire length are minimized, facilitating production of discrete wire segments especially suited for use in EAS applications.


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