The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2008
Filed:
Jun. 02, 2004
Osamu Itatani, Kyoto, JP;
Masato Sagawa, Kyoto, JP;
Osamu Itatani, Kyoto, JP;
Masato Sagawa, Kyoto, JP;
Intermetallics Co., Ltd., Kyoto, JP;
Abstract
In a method for forming an adhesive layer on the surface of a workpiece before the formation of a coating film containing a powder on the workpiece, the present invention provides a method for forming the adhesive layer having a desired thickness. This object is achieved by the following method: An adhesive layer formation medium mcoated with an adhesive material is made to collide with a workpiece W so that the adhesive material is transferred from the adhesive layer formation medium mto the workpiece W and forms an adhesive layer on the workpiece. An adhesive layer having a desired thickness can be formed on the workpiece by regulating the thickness of the adhesive material applied to the surface of the adhesive layer formation medium (i.e. the amount of the adhesive material held by a single adhesive layer formation medium). This enables the thickness of the powder coating as the final product to be controlled as desired.