The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2008
Filed:
Feb. 26, 2004
Uwe Hofmann, Neu-Ulm, DE;
Wolfgang Dannenmann, Langenau, DE;
Doris Humpenoeder-boegel, Legal Representative, Weissenhorn, DE;
Monika Breu, Ulm, DE;
Guenter Schmid, Altenstadt, DE;
Joerg Seeger, Ulm, DE;
Uwe Hofmann, Neu-Ulm, DE;
Wolfgang Dannenmann, Langenau, DE;
Doris Humpenoeder-Boegel, legal representative, Weissenhorn, DE;
Monika Breu, Ulm, DE;
Guenter Schmid, Altenstadt, DE;
Joerg Seeger, Ulm, DE;
Wieland-Werke AG, Ulm, DE;
Abstract
A lead-free copper alloy based on Cu—Zn—Si and a method of manufacture thereof. The copper alloy is built on the basis of copper, zinc and silicon without toxic additives and consists of: 70 to 83% Cu, 1 to 5% Si and the further matrix-active elements: 0.01 to 2% Sn, 0.01 to 0.3% Fe and/or Co, 0.01 to 0.3% Ni, 0.01 to 0.3% Mn, the remainder Zn and unavoidable impurities.