The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2008
Filed:
Feb. 06, 2004
Shinji Hada, Tokyo, JP;
Hiroyuki Sakai, Tokyo, JP;
Tadayuki Fujimoto, Tokyo, JP;
Hoya Corporation, Tokyo, JP;
Abstract
A molding apparatus for molding a press-molded product by heating and softening a material and press-molding the material into a predetermined shape by the use of a mold, includes a pair of dies which form the mold, each of which comprises a molding surface facing with the other, and one of which is fixed to a structure member of the molding apparatus, driving means for moving the other die towards and away from the one die, heating means for heating the dies, detecting means for detecting the displacement of a part displaced by thermal deformation of the structure member, and a control section for calculating a correction value for a moving distance of the other die with reference to the result of detection by the detecting means and delivering an instruction to the driving means so as to move the other die in accordance with the moving distance corrected by the correction value.