The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2008
Filed:
Sep. 12, 2005
Kenneth Fallon, Rochester, NY (US);
Miguel A. Jimarez, Newark Valley, NY (US);
Ross W. Keesler, Endicott, NY (US);
John M. Lauffer, Waverly, NY (US);
Roy H. Magnuson, Endicott, NY (US);
Voya R. Markovich, Endwell, NY (US);
Irv Memis, Vestal, NY (US);
Jim P. Paoletti, Endwell, NY (US);
Marybeth Perrino, Apalachin, NY (US);
John A. Welsh, Binghamton, NY (US);
William E. Wilson, Waverly, NY (US);
Kenneth Fallon, Rochester, NY (US);
Miguel A. Jimarez, Newark Valley, NY (US);
Ross W. Keesler, Endicott, NY (US);
John M. Lauffer, Waverly, NY (US);
Roy H. Magnuson, Endicott, NY (US);
Voya R. Markovich, Endwell, NY (US);
Irv Memis, Vestal, NY (US);
Jim P. Paoletti, Endwell, NY (US);
Marybeth Perrino, Apalachin, NY (US);
John A. Welsh, Binghamton, NY (US);
William E. Wilson, Waverly, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method of forming a printed circuit card with a metal power plane layer between two photoimageable dielectric layers is provided. Photoformed metal filled vias and plated through holes are in the photopatternable material, and signal circuitry is on the surfaces of each of the dielectric materials connected to the vias and plated through holes. A border may be around the card including a metal layer terminating in from the edge of one of the dielectric layers. Copper foil with clearance holes is provided. First and second layers of photoimageable curable dielectric material are on opposite sides of the copper. Patterns are developed on the first and second layers of the photoimageable material to reveal the metal layer through vias. Through holes are developed where holes were patterned in both dielectric layers. The surfaces of the photoimageable material, vias and through holes are metallized by copper plating, preferably using photoresist.