The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2008
Filed:
Jun. 27, 2003
Thomas S. Ellis, Romeo, MI (US);
Glen E. Novak, Romeo, MI (US);
Bruce A. Myers, Kokomo, IN (US);
Scott D. Brandenburg, Kokomo, IN (US);
Jeenhuei S. Tsai, Carmel, IN (US);
Thomas S. Ellis, Romeo, MI (US);
Glen E. Novak, Romeo, MI (US);
Bruce A. Myers, Kokomo, IN (US);
Scott D. Brandenburg, Kokomo, IN (US);
Jeenhuei S. Tsai, Carmel, IN (US);
Delphi Technologies, Inc., Troy, MI (US);
Abstract
Improved encapsulated, overmolded and/or underfilled electrical components having a complete encapsulation, overmolding and/or underfilling with a coefficient of thermal expansion that is uniform and substantially free of gradients includes a polymeric matrix and an inorganic filler having a platelet geometric structure. The platelet structure of the filler allows a desirable coefficient of thermal expansion to be achieved using a very low level of filler material. This low level of filler material facilitates lower viscosity during forming of the encapsulation and/or overmolding, thereby facilitating complete filling of a mold cavity and underfilling of space between a circuit board and a semi-conductor chip electrically connected to the circuit board. In addition, the low viscosity has processing advantages that reduce the potential for damage to electrical components during encapsulation, overmolding and/or underfilling.