The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2008
Filed:
Nov. 29, 2004
Jin-yong Ahn, Daejeon, KR;
Chang-sup Ryu, Daejeon, KR;
Suk-hyeon Cho, Daejeon, KR;
Seok-kyu Lee, Chungcheongbuk-do, KR;
Jong-kuk Hong, Chungcheongnam-do, KR;
Ho-sik Jun, Chungcheongbuk-do, KR;
Jin-Yong Ahn, Daejeon, KR;
Chang-Sup Ryu, Daejeon, KR;
Suk-Hyeon Cho, Daejeon, KR;
Seok-Kyu Lee, Chungcheongbuk-do, KR;
Jong-Kuk Hong, Chungcheongnam-do, KR;
Ho-Sik Jun, Chungcheongbuk-do, KR;
Samsung Electro-Mechanics Co., Ltd., Kyunggi-do, KR;
Abstract
A printed circuit board (PCB) having at least one embedded capacitor and a method of fabricating the same is provided. A dielectric layer is formed using a ceramic material having a high capacitance, thereby assuring that the capacitors each have a high dielectric constant corresponding to the capacitance of a decoupling chip capacitor.