The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 01, 2008

Filed:

Apr. 21, 2005
Applicant:

Yuji Shinkai, Handa, JP;

Inventor:

Yuji Shinkai, Handa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 23/52 (2006.01); H01L 23/48 (2006.01); H01L 29/40 (2006.01); H01L 23/485 (2006.01); B41J 2/14 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of producing a recording head unit including: (A) a recording head including: a plurality of recording elements; and an actuator unit including a plurality of individual electrodes which respectively correspond to the recording elements; and (B) a printed wiring board which includes conductive leads respectively having terminal portions, which is electrically connected to the individual electrodes, and through which an operating signal for operating the recording elements is supplied to the individual electrodes, the method including: forming a plurality of conductive bumps on a surface of the actuator unit such that the bumps protrude from the surface of the actuator unit, so as to be electrically connected to the individual electrodes, respectively; coating a surface of the printed wiring board with an uncured synthetic resin to form an uncured synthetic-resin layer covering the conductive leads of the printed wiring board; bringing the bumps and the terminal portions of the conductive leads into contact with one another by pressing the bumps onto the uncured synthetic-resin layer such that the bumps penetrate the uncured synthetic-resin layer; and curing the uncured synthetic-resin layer.


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