The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 01, 2008

Filed:

Jan. 29, 2004
Applicants:

Jay A. Morrison, Oviedo, FL (US);

Gary B. Merrill, Orlando, FL (US);

Steven James Vance, Orlando, FL (US);

Michael A. Burke, Pittsburgh, PA (US);

Inventors:

Jay A. Morrison, Oviedo, FL (US);

Gary B. Merrill, Orlando, FL (US);

Steven James Vance, Orlando, FL (US);

Michael A. Burke, Pittsburgh, PA (US);

Assignee:

Siemens Power Generation, Inc., Orlando, FL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B28B 11/00 (2006.01); B28B 5/00 (2006.01); B29C 33/76 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of manufacturing a hybrid structure () having a layer of CMC material () defining an interior passageway () and a layer of ceramic insulating material () lining the passageway. The method includes the step of casting the insulating material to a first thickness required for effective casting but in excess of a desired second thickness for use of the hybrid structure. An inner mold () defining a net shape desired for the passageway remains in place after the casting step to mechanically support the insulating material during a machining process used to reduce the thickness of the insulating material from the as-cast first thickness to the desired second thickness. The inner mold also provides support as the CMC material is deposited onto the insulating material. The inner mold may include a fugitive material portion () to facilitate its removal after the CMC material is formed.


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