The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 01, 2008

Filed:

Aug. 02, 2006
Applicants:

Yuuichi Yakumaru, Osaka, JP;

Tomoichiro Tamura, Osaka, JP;

Tetsuya Saito, Osaka, JP;

Masaya Honma, Osaka, JP;

Inventors:

Yuuichi Yakumaru, Osaka, JP;

Tomoichiro Tamura, Osaka, JP;

Tetsuya Saito, Osaka, JP;

Masaya Honma, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F25B 1/00 (2006.01); F25B 13/00 (2006.01); F25D 9/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides a heat pump including: a compressor; a radiator; a first throttling device having a variable opening; an expander; a second throttling device having a variable opening; an evaporator; piping that connects the compressor, the radiator, the first throttling device, the expander, the second throttling device, and the evaporator so that refrigerant circulates thorough the elements in that order; and a control device for controlling the opening of the first throttling device and the opening of the second throttling device. This heat pump is capable of independently controlling the pressure of the refrigerant flowing into the expander (intermediate pressure) and pressure in a high-pressure side of a refrigeration cycle, and also is capable of size reduction, or in some cases elimination, of a receiver for the refrigerant.


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