The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 25, 2008

Filed:

Jul. 18, 2003
Applicant:

Hideki Ando, Kyoto, JP;

Inventor:

Hideki Ando, Kyoto, JP;

Assignee:

Rohm Co., Ltd., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 9/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A capacitor element in which a dielectric film, a solid electrolyte layer, and a cathode-side electrode film are formed on the anode chip body obtained by sintering a powder of a valve-acting metal is manufactured without causing decrease in the effective volume of the metal powder or degradation of electric connection. This is attained by adhesively attaching one end surface of the anode chip body to the surface of a metal plate with an electrically conductive adhesive, so that the end surface can be peeled off from the metal plate, successively forming a dielectric film, a solid electrolyte layer, and a cathode-side electrode film, in this order, on the anode chip body in this state to form a capacitor element, and peeling the capacitor element off and separating it from the metal plate.


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